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Wafer-Scale Doping and Low-Temp Growth Advance 2D Semiconductor Integration

Uniform substitutional doping of MoS₂ across large wafers overcomes long-standing challenges in film homogeneity that have stalled 2D device manufacturing.

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Overview

  • A novel metal-assisted van der Waals epitaxy method produced four-inch monolayer MoS₂ films with precise transition-metal substitutional doping and atomic-scale uniformity.
  • Fe-doped MoS₂ transistors delivered electron mobilities up to 71.2 cm²/V·s and on/off ratios beyond 10⁸, with roughly 265,000 top-gate devices integrated on a single wafer showing consistent performance.
  • CDimension’s proprietary CVD process enables direct growth of monolayer MoS₂ on silicon at about 200 °C without harming underlying circuits, paving the way for 3D stacking of 2D devices.
  • Researchers predict these wafer-scale 2D processes could meet the power, performance and footprint requirements of future sub-1 nm (10A) logic nodes.
  • Key hurdles remain in scaling defect-free large-area films and adapting fabrication workflows for full-scale integrated circuit production.