Overview

• Opposition leaders have accused the government of bias in assigning the latest semiconductor projects, alleging facilities earmarked for Telangana and Tamil Nadu were shifted to Andhra Pradesh and Gujarat.
• SiCSem Pvt Ltd, in partnership with UK’s Clas-SiC Wafer Fab, will establish India’s first commercial silicon carbide compound fabrication plant in Bhubaneswar with annual output of 60,000 wafers and 96 million packaged units.
• 3D Glass Solutions Inc. will build a vertically integrated 3D glass-based advanced packaging and embedded substrate facility in Odisha backed by reported investments from Intel and Lockheed Martin.
• Continental Device India Ltd is set to expand its Mohali facility in Punjab to manufacture 158.38 million high-power discrete semiconductors annually, while Advanced System in Package Technologies will open a 96 million-unit packaging plant in Andhra Pradesh in collaboration with South Korea’s APACT Co. Ltd.
• The four approvals commit about Rs 4,600 crore of fresh investment, are expected to create roughly 2,034 skilled direct jobs, and launch construction imminently with operations slated within two to three years.