TSMC's Advanced Packaging Fully Booked by NVIDIA and AMD Until 2025

The semiconductor giant is rapidly expanding production to meet soaring AI demand, with significant capacity increases planned.

TSMC's advanced packaging facilities, including CoWoS and SoIC, are fully reserved by major AI players NVIDIA and AMD for the next two years.
The company plans to triple CoWoS production and significantly boost SoIC output by 2025, reflecting aggressive expansion strategies.
New plants and increased production capabilities are set to solidify TSMC's role as a key player in the AI and high-performance computing sectors.
Despite a recent earthquake, TSMC's production timelines remain on track, with no significant impact reported on chip supply.
Collaborations, such as the partnership with SK hynix on HBM4 development, underscore TSMC's commitment to advancing semiconductor technology.