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TSMC’s 2nm Push Accelerates as MediaTek Tapes Out and Reports Indicate Apple Secures Early Capacity

TSMC is preparing multi-site mass production with a goal of 100,000 wafers per month in 2026.

Overview

  • MediaTek confirmed a flagship SoC has completed 2nm tape-out, with mass production guided for the second half of 2025 and a likely market debut in late 2026, according to Taipei Times.
  • TSMC’s N2 node introduces nanosheet transistors with claimed 24–35% lower power at the same voltage or up to 15% higher performance versus prior generation disclosures.
  • Production is slated to ramp across facilities in Baoshan, Hsinchu, and Kaohsiung starting in the fourth quarter as TSMC moves from trial runs to volume output.
  • Economic News Daily, as cited by Wccftech, reports Apple has secured more than half of TSMC’s initial 2nm capacity and booked the first Baoshan batch, while Qualcomm and MediaTek target launches in 2026.
  • Benzinga reports broader customer interest from Intel, AMD, and Nvidia, and TSMC is planning a new service center in Pingtung County for mid-2027 to bolster its advanced-node ecosystem.