TSMC’s $165 Billion U.S. Investment Faces Criticism Over Lack of Core R&D Relocation

Experts argue that TSMC's focus on refining existing processes in the U.S. limits the nation's ability to regain semiconductor leadership.

TSMC has committed $165 billion to expand U.S. semiconductor manufacturing, including six fabs, advanced packaging facilities, and an R&D center in Arizona.
The R&D center will focus on refining existing processes rather than developing next-generation technologies, with core R&D remaining in Taiwan.
Former Intel CEO Pat Gelsinger asserts that U.S. semiconductor leadership requires domestic development of next-generation transistor technologies.
Geopolitical pressures, tariff threats, and supply chain security concerns have driven TSMC’s U.S. expansion, but experts question its strategic impact.
Taiwan's government continues to oversee TSMC's overseas ventures, balancing its 'silicon shield' geopolitical leverage with global supply chain demands.