TSMC's $165 Billion U.S. Expansion Faces Criticism Over Lack of Core R&D Relocation

Despite significant investment in U.S. chip manufacturing, experts argue the absence of next-gen R&D undermines efforts to achieve semiconductor leadership.

TSMC has committed $165 billion to U.S. semiconductor facilities, including six fabs, advanced packaging plants, and an R&D center in Arizona.
Critics, including former Intel CEO Pat Gelsinger, argue that without relocating core R&D from Taiwan, the U.S. cannot achieve semiconductor leadership.
TSMC's U.S. R&D is expected to focus on refining existing processes rather than developing next-generation technologies, raising concerns about innovation.
Taiwan's government closely monitors TSMC's overseas ventures and has resisted transferring advanced chipmaking technology abroad.
Geopolitical pressures, supply chain security concerns, and tariff threats have influenced TSMC's U.S. expansion strategy but have not addressed leadership in innovation.