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TSMC Weighs Costly High-NA EUV Upgrade as Intel Drives Ahead with 14A Plan

TSMC is extending the life of its existing low-NA EUV tools for its A14 node to defer the nearly $400 million investment

A view shows the logo of Dutch computer chip equipment supplier ASML, in Veldhoven, Netherlands, January 29 2025. REUTERS/Piroschka van de Wouw/File Photo
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Overview

  • TSMC executive Kevin Zhang said the company has yet to find a compelling reason to deploy High-NA EUV for its upcoming A14 process.
  • Zhang noted that enhancements to current low-NA EUV machines can deliver substantial scaling benefits without the premium price of High-NA tools.
  • Intel has committed to integrating ASML’s High-NA EUV scanners into its 14A manufacturing process to sharpen its competitive edge in contract chip production.
  • ASML has shipped five High-NA EUV systems globally to customers including Intel, TSMC and Samsung.
  • TSMC began accepting orders for its 2nm process earlier this year and targets mass production of its 1.4nm node by 2028.