Overview

• Industry reports set initial output at Baoshan (Fab 20) and Kaohsiung (Fab 22), surpassing 100,000 wafers per month in 2026 and approaching roughly 200,000 per month by 2028 with Arizona expansion.
• Early allocation carries a reported price of about $30,000 per wafer, concentrating supply with Apple while Qualcomm is cited as the second-largest customer.
• Other major clients reserving capacity include AMD, MediaTek, Broadcom and Intel, with NVIDIA, Amazon’s Annapurna, Google and additional firms expected to join mass production in 2027.
• Analysts and trade reporting indicate Apple plans to use first‑generation N2 for its A20 chip in the 2026 iPhone 18 lineup, with projected gains of roughly 10–15% performance and up to 30% power efficiency versus current 3nm parts.
• Separate reporting says TSMC is accelerating a 1.4nm “A14” Fab 25 in central Taiwan, targeting trial production by late 2027 with an initial investment near NT$1.5 trillion (about $49 billion).