TSMC to Double Chip Packaging Capacity Amid AI Demand Surge

Driven by demand from tech giants, Taiwan Semiconductor Manufacturing Company plans significant expansion in advanced chip production by 2025.

TSMC's CoWoS advanced packaging is experiencing unprecedented demand, particularly from AI chip manufacturers like Nvidia.
The company plans to double its production capacity by 2025, with Nvidia expected to utilize over half of this capacity.
TSMC's Arizona plant has achieved 4% higher yields than its Taiwan facilities, boosting confidence in its international expansion.
The company's CEO forecasts that AI chips will triple in revenue contribution, accounting for a mid-teens percentage of total revenue in 2024.
TSMC's expansion efforts are critical to meeting the growing needs of AI technology, with significant investments in the U.S., Japan, and Europe.