TSMC to Begin Construction on First European Chip Plant in Germany

The Dresden facility, a €10 billion joint venture with European firms, aims to boost regional semiconductor production by 2027.

Groundbreaking ceremony scheduled for August 20, led by TSMC CEO C.C. Wei.
The plant, known as European Semiconductor Manufacturing Corp (ESMC), involves partners Bosch, Infineon, and NXP.
ESMC will focus on producing older process nodes for automotive and industrial applications.
The German government is providing €3.5 billion in subsidies to support the project.
The facility is expected to create 2,000 high-tech jobs and enhance EU semiconductor capabilities.