TSMC Plans Advanced 1nm Chip Facility in Taiwan, Targeting 2030 Production

The semiconductor leader is constructing a state-of-the-art 'Fab 25' in Tainan, supported by government incentives, to advance cutting-edge chipmaking technology.

• TSMC aims to begin 1nm chip production by 2030 at its newly proposed 'Fab 25' facility in Tainan, Taiwan.
• The facility will feature six production lines for 12-inch wafers and is part of TSMC's broader investment in advanced semiconductor nodes.
• In addition to 1nm, TSMC plans to build new fabs for its 2nm and 1.4nm processes in the same region, leveraging government incentives.
• The company has outlined ambitions for integrating up to one trillion transistors in its 1nm chips through advanced 3D-stacked architectures.
• TSMC continues to strengthen Taiwan's position as a global semiconductor hub while also expanding its international presence, including significant investments in Arizona, USA.

3 Articles

TweakTown Wccftech Benzinga