Overview

• TSMC’s European Union Design Center (EUDC) is slated to open in the third quarter of 2025 to co-develop customer chip designs.
• The Munich facility will target automotive microcontrollers using RRAM and MRAM and expand into industrial, AI, telecom, and IoT applications.
• EUDC’s outputs will feed production either at TSMC’s global fabs or at the European Semiconductor Manufacturing Company plant in Dresden.
• The Dresden ESMC factory, whose groundbreaking took place in August 2024, aims to start manufacturing 28- to 12-nanometer chips by late 2027.
• EU Chips Act funding, coupled with TSMC’s multibillion-dollar investments in Germany and the U.S., seeks to bolster regional supply-chain resilience.