TSMC Develops Rectangular Substrates to Boost AI Chip Production

The new panel-level packaging aims to increase efficiency and meet growing computing demands.

TSMC's rectangular substrates measure 510mm by 515mm, tripling the usable area of traditional round wafers.
This new packaging method is in early trial stages and may take years to commercialize.
Transitioning to rectangular substrates requires significant changes to production tools and materials.
Panel-level packaging is expected to reduce waste and improve chip production efficiency.
Competitors like Samsung are also exploring advanced substrate technologies to stay competitive.