TSMC Breaks Ground on $11 Billion Chip Plant in Germany

The new Dresden facility, supported by significant EU funding, aims to bolster Europe's semiconductor independence by 2027.

The plant is a joint venture between TSMC, Bosch, Infineon, and NXP, with TSMC holding a 70% stake.
The European Semiconductor Manufacturing Company (ESMC) will focus on automotive and industrial applications.
The EU Chips Act provided €5 billion in state aid, the largest grant to date under the initiative.
Production is expected to begin by the end of 2027, with a capacity of 480,000 silicon wafers annually.
The project aims to reduce Europe's reliance on Asian chip imports amid geopolitical tensions.