TSMC announces €22 billion plan to build semiconductor factory in Germany

Taiwanese chipmaker TSMC plans to build a €12 billion factory in Dresden, Germany with Bosch, Infineon and NXP.
The factory is set to open in 2027 with a capacity of 40,000 wafers per month.
The German government will contribute €5 billion for construction from its climate and transformation fund.
The move is part of a wider European effort to increase domestic chip production and supply chain resilience.
TSMC will hold a 70% stake in the joint venture, with the other partners each holding 10%.