TSMC and Intel Intensify Competition with Advanced Chip Technologies

TSMC announces A16 process for 2026, rivaling Intel's accelerated chip development.

TSMC's A16 process, set for 2026, promises significant performance improvements with its backside power delivery system.
Intel counters with its High-NA EUV lithography and backside power technologies aiming for a 2025 rollout.
Both companies focus on enhancing AI chip capabilities, with TSMC not requiring ASML's latest High-NA EUV machines.
Intel's substantial investment in EUV technology contrasts with TSMC's approach, focusing on cost efficiency.
The race for semiconductor supremacy heats up as both giants push the boundaries of chip performance and efficiency.