TSMC and Amkor Forge Partnership to Boost U.S. Chip Packaging

The collaboration aims to enhance semiconductor manufacturing in Arizona, aligning with the CHIPS Act's goals.

TSMC and Amkor Technology have signed a memorandum of understanding to establish an advanced chip packaging facility in Peoria, Arizona.
This initiative is part of a broader effort to strengthen the U.S. semiconductor supply chain and reduce dependency on foreign production.
The advanced packaging techniques, such as TSMC's Integrated Fan-Out and Chip-on-Wafer-on-Substrate, will support high-performance computing and communications markets.
Apple is set to benefit from this development, with Amkor investing $2 billion and planning to employ over 2,000 people at the new facility.
The partnership reflects TSMC's commitment to expanding its U.S. presence, supported by the CHIPS Act's $52 billion investment in domestic semiconductor infrastructure.