TSMC Achieves Full Capacity in 5nm and 3nm Production Amid Surging Demand

TSMC's semiconductor production lines are fully booked through mid-2025, driven by high demand from AI, Qualcomm, and MediaTek.

TSMC's 5nm and 3nm production lines are operating at 100% utilization due to unprecedented demand for AI chips and mobile processors.
The surge in demand is largely fueled by NVIDIA's Blackwell series AI GPUs and smartphone chip orders from Qualcomm and MediaTek.
TSMC plans to increase its production capacity with new facilities in the US and Japan to meet the growing demand for advanced packaging.
The company expects to double its CoWoS advanced packaging output by the end of 2024 and again in 2025.
TSMC's dominance in the semiconductor market is reinforced by its ability to meet the high demand while competitors face challenges.