Overview

• TSMC's 5nm and 3nm production lines are operating at 100% utilization due to unprecedented demand for AI chips and mobile processors.
• The surge in demand is largely fueled by NVIDIA's Blackwell series AI GPUs and smartphone chip orders from Qualcomm and MediaTek.
• TSMC plans to increase its production capacity with new facilities in the US and Japan to meet the growing demand for advanced packaging.
• The company expects to double its CoWoS advanced packaging output by the end of 2024 and again in 2025.
• TSMC's dominance in the semiconductor market is reinforced by its ability to meet the high demand while competitors face challenges.