Overview

• Huawei is aiming to double Ascend 910C output to about 600,000 units in 2026 and projects up to 1.6 million Ascend-series dies next year, according to Bloomberg reporting cited by Asia Times.
• A TechInsights teardown found TSMC-made dies inside the Ascend 910C and older HBM2E from Samsung and SK Hynix, with the Korean suppliers saying they stopped sales to Huawei after 2020 export controls.
• Analysts estimate Huawei stockpiled nearly 3 million TSMC dies via intermediary Sophgo before sanctions cut off the channel, and TSMC later halted shipments to Sophgo after a diverted die was identified.
• Huawei is pursuing cluster-scale performance through its UnifiedBus interconnect and Atlas 950/960 SuperPod and SuperCluster systems, which the company says can link thousands to hundreds of thousands of Ascend cards.
• Regulatory pressure increased with a new BIS rule extending restrictions to affiliates, and analysts warn HBM supplies could tighten by late 2025, with one report suggesting 2026 output might land closer to 1 million units despite Huawei’s targets.