Overview
- The offering covers design and verification for UCIe interconnects and HBM memory, plus advanced 2.5D and 3D packaging for multi-chip systems.
- TCS said it is working with a North American semiconductor firm to integrate multiple chiplets for faster delivery of AI processors.
- Chiplet architectures let manufacturers mix and match pre-tested dies to cut costs and shorten time to market as traditional scaling slows.
- TCS positions the service within India’s Rs 76,000-crore India Semiconductor Mission and a market projected to grow from $45–50 billion to $100–110 billion by 2030.
- Recent Semicon India initiatives include an IBM-backed research center for advanced packaging, a planned Powerchip-linked fab in Gujarat by 2026, and an assembly and testing unit in Assam.