Overview
- Under the December 8 MoU, the companies will evaluate manufacturing and packaging of Intel products at Tata’s planned Gujarat fab and Assam OSAT and explore advanced packaging in India.
- Intel CEO Lip-Bu Tan met PM Narendra Modi on December 9 and publicly affirmed Intel’s commitment to support the India Semiconductor Mission.
- Tata Electronics is investing roughly $14 billion to build the two facilities, with Intel identified as a prospective customer under the exploratory agreement.
- Media reports cite provisional timelines with the Assam chip assembly and test unit aiming to start operations in Q2 next year and the Gujarat fab targeting production in 2027, though firm contracts and volumes are not confirmed.
- The partners also plan to assess scaling AI-focused PC solutions for India using Intel’s AI compute reference designs and Tata Electronics’ EMS capabilities.