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Tata, Intel Sign MoU to Explore Chip Manufacturing, Packaging, and AI PCs in India

The pact begins exploratory planning to localize Intel products using Tata’s planned fab, OSAT, and EMS capabilities to strengthen supply-chain resilience.

Overview

  • Signed on December 8, 2025, the Memorandum of Understanding formalizes a strategic alliance to bolster India’s semiconductor and compute ecosystem.
  • The companies will investigate manufacturing and packaging of Intel products at Tata Electronics’ forthcoming fab and OSAT facilities, with advanced packaging under evaluation.
  • The collaboration also targets scaling AI-enabled PC solutions for consumer and enterprise markets by pairing Intel’s AI compute reference designs with Tata’s EMS.
  • Leadership from Tata Sons, Intel, and Tata Electronics cast the effort as aligned with Tata’s EMS–OSAT–fab roadmap and focused on India’s fast-growing compute demand.
  • No binding investments or firm timelines were disclosed, while India is projected to become a top-five global market for compute by 2030.