Overview

• The memorandum of understanding signed on July 17–18 commits both companies to jointly develop semiconductor chip packaging and manufacturing capabilities in India.
• Tata Electronics will operate an assembly and testing unit in Assam while the partners co-develop a foundry facility in Gujarat.
• The pact includes plans to pursue local electronic manufacturing services projects aimed at producing vehicle electronics and strengthening supply chain resilience.
• Neither Tata Electronics nor Bosch has revealed investment sizes or project schedules for the Assam and Gujarat sites.
• Tata Electronics is also exploring further expansion through talks with X-Fab, DNeX and Globetronics on potential OSAT facility acquisitions in Malaysia.