Overview
- Signed on December 8, the memorandum outlines a strategic alliance to strengthen India’s semiconductor and compute ecosystem with a more geo‑resilient supply chain.
- The companies will assess manufacturing and packaging of Intel products at Tata Electronics’ upcoming fab in Dholera, Gujarat, and its OSAT facility in Assam.
- The collaboration includes exploring advanced packaging capabilities within India to support domestic production of next‑generation components.
- Tata’s chip program totals about Rs 1.18 lakh crore (approximately $14 billion) for the two facilities, while the MoU remains non‑binding with no specific production commitments disclosed.
- Tata Electronics identified Intel as a first major prospective customer and both sides will evaluate ways to scale AI‑enabled PC and systems solutions using Intel’s AI reference designs and Tata’s EMS strengths.