Overview
- President Lee Jae Myung presided over a strategy session with executives from Samsung Electronics, SK hynix and AI startups to set a top‑tier global goal for the sector.
- The plan earmarks 700 trillion won to build 10 fabrication plants and envisions the world’s largest production cluster to meet AI‑driven demand.
- Targeted R&D includes 1.27 trillion won for AI chips over five years, 215.9 billion won by 2032 for next‑generation memory such as NPUs and PIM, 260.1 billion won for compound semiconductors and 360.6 billion won for advanced packaging by 2031.
- A public‑private foundry initiative is under review, including a proposed 4.5 trillion won, 40‑nanometer facility to provide dedicated capacity for domestic fabless firms and support so‑called middle‑tech chips.
- A southern industrial belt is planned with packaging in Gwangju, power semiconductors in Busan and materials and parts in Gumi, alongside a 2027 test bed for materials and equipment, expanded semiconductor graduate programs by 2030 and an Arm partnership to train 1,400 designers.