Overview
- The agreement formalizes a joint effort to develop next‑generation memory for AI and high‑performance computing, with commercialization targeted for fiscal 2029.
- Intel will contribute engineering expertise and technology informed by its Next Generation DRAM Bonding work and the U.S. Department of Energy’s Advanced Memory Technology program.
- Shares rose following the announcement, with SoftBank up 3.13% and Intel up about 5% in overnight trading.
- Reporting points to participation from a Japanese consortium that includes Fujitsu and Riken as well as potential government subsidies, which have not been formally detailed.
- Some coverage cites goals of two to three times current HBM capacity at roughly half the power and a SoftBank funding contribution of about $20 million, figures that remain unverified.