Overview
- A handful of producers have redirected wafer capacity toward high‑bandwidth memory (HBM) used in AI data centers, reducing allocation of standard DRAM and NAND for independent device makers.
- Independent brands report availability, not price, is the main problem because they lack long‑term contracts and cannot secure the allocations that large OEMs obtain.
- The squeeze makes memory a larger share of costs for budget devices and risks making entry‑level phones and low‑cost laptops uneconomical to build.
- Smaller companies are adapting by redesigning motherboards, modularizing memory, testing incoming chips for counterfeits, and offering paid upgrades or repricing to manage intermittent supply and higher input costs.
- Industry forecasts and executives warn tight supply will persist through 2027 with normalization not likely until 2028 or later, which could keep shipment declines and higher consumer prices in place.