Overview

• SK Hynix projects HBM demand will climb about 30% annually through 2030 and expects the custom memory segment to be worth tens of billions of dollars by that time.
• Next-generation HBM4 stacks will embed client-specific base dies, marking a shift from standardized DRAM to bespoke designs that limit vendor interchangeability and raise production complexity.
• The added complexity has led SK Hynix to implement significant HBM4 price hikes, triggering what industry reports describe as a “war of nerves” with Nvidia over contract terms.
• Samsung is accelerating its HBM4 development after missing early opportunities in AI memory and ceding market share to SK Hynix.
• Threats of 100% U.S. tariffs on imported chips have spurred South Korean suppliers to expand U.S. fabrication, packaging and R&D facilities to secure local supply chains.