SK hynix Secures $458M in U.S. Funding for AI Chip Packaging Facility

The South Korean firm will establish a $3.87 billion memory packaging plant in Indiana, creating 1,000 jobs and bolstering America's AI semiconductor supply chain.

• The U.S. Commerce Department finalized a $458 million grant for SK hynix under the CHIPS Act to build an advanced chip packaging facility in Indiana.
• The $3.87 billion project will include a research and development hub and focus on high bandwidth memory (HBM) packaging for AI products.
• SK hynix will also receive up to $500 million in government loans to support the facility, which is expected to begin production in 2028.
• The facility will create approximately 1,000 direct jobs and address a critical gap in the U.S. semiconductor supply chain.
• This investment aligns with broader efforts to strengthen U.S. semiconductor manufacturing, with other companies like TSMC, Intel, and Micron also receiving CHIPS Act funding.

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