Overview
- Intel’s Advanced Data Center Development Laboratory completed rigorous validation, making SK hynix the first with a 256GB DDR5 RDIMM based on 32Gb 10nm-class (1b) DRAM cleared for the Xeon 6 platform.
- The module reaches 256GB using 32Gb chips with through-silicon vias and 3D stacking techniques that borrow from high-bandwidth memory packaging.
- SK hynix reports servers using the module deliver up to 16% higher AI inference performance versus 32Gb-die 128GB configurations and about 18% lower power than prior 256GB modules built on 16Gb 1a DRAM.
- With certification in place, the part can be adopted immediately in Xeon 6 servers, and verified modules are typically purchased in bulk by OEMs including Dell, HP and Supermicro.
- The move highlights intensifying memory competition as Samsung pursues Socamm2 modules with Nvidia and Micron supplies samples, while conventional high-capacity DRAM remains a key constraint for AI data centers.