Overview

• SK hynix says it finished HBM4 development and set up the industry's first production system for the chip at its Incheon, South Korea facility.
• HBM4 doubles input‑output channels to 2,048 and overall bandwidth versus HBM3E, running above 10 Gbps to surpass the 8 Gbps JEDEC baseline.
• The company claims more than 40 percent better power efficiency than HBM3E and up to 69 percent improvement in AI service performance.
• Qualification with customers follows co-development consultations, with reports indicating Nvidia intends to use HBM4 in upcoming GPUs.
• SK hynix cites Advanced MR-MUF packaging and its fifth-generation 10-nanometer DRAM process as enablers for thermal management, stacking, and mass-production stability.