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SK hynix Commits ₩19 Trillion to Cheongju Packaging Plant to Scale HBM

The project links the new back-end facility with SK hynix's M15X fab to consolidate AI memory production.

Overview

  • Construction is scheduled to begin in April 2026 with completion targeted before the end of 2027.
  • The P&T7 facility will be built on a 231,000-square-meter site within the Cheongju Technopolis Industrial Complex.
  • SK hynix says proximity to the M15X front-end plant will enable an integrated flow from wafer fabrication to advanced packaging for HBM.
  • The M15X cleanroom opened ahead of schedule in October and production equipment installation is underway.
  • SK hynix cites projections of roughly 33% annual HBM market growth through 2030 as rivals expand capacity and conventional memory supply tightens.