Overview

• SK hynix says it has started shipping mobile DRAM that uses an industry-first High-K epoxy molding compound for improved heat dissipation.
• The company reports 3.5 times higher thermal conductivity and a 47% reduction in vertical thermal resistance compared with conventional materials.
• The approach is aimed at overheating tied to fast on-device AI data transfers and package-on-package layouts that place DRAM over application processors.
• SK hynix expects lower power draw to translate into longer battery runtime and extended smartphone lifespan for users.
• The launch has been welcomed by global smartphone makers, and executive Lee Gyu-jei characterized the materials shift as a meaningful advance in mobile DRAM.