SK Hynix Begins Mass Production of Industry-First 12-Layer HBM3E Memory

The new 36GB capacity chips, designed for AI applications, offer the highest memory speed at 9.6Gbps and will be delivered by year-end.

SK Hynix has started mass production of the world's first 12-layer HBM3E memory chips, boasting a 36GB capacity.
The chips offer a 50% increase in capacity compared to the previous 8-layer versions while maintaining the same thickness.
These high-bandwidth memory chips are designed to meet the growing demand for AI applications, with speeds reaching 9.6Gbps.
SK Hynix plans to supply these advanced memory products to customers, including NVIDIA, by the end of the year.
The announcement has led to a significant rise in SK Hynix's stock price, reflecting strong market optimism driven by the AI boom.