SK hynix and TSMC Forge Strategic Partnership to Advance Next-Generation AI Memory Technology

The collaboration focuses on developing HBM4 chips, aiming to enhance AI applications' performance by leveraging advanced semiconductor technologies.

SK hynix and TSMC have signed a memorandum of understanding to jointly develop and produce next-generation high-bandwidth memory (HBM) chips, known as HBM4, slated for mass production in 2026.
The partnership will utilize TSMC's advanced logic process and SK hynix's expertise in memory to innovate and improve the performance and efficiency of HBM technology.
This collaboration marks a significant step in integrating cutting-edge semiconductor packaging technologies, including TSMC's CoWoS (Chip on Wafer on Substrate) process.
The strategic alliance aims to meet the growing demand for high-performance, power-efficient AI memory solutions across various industries.
Both companies have a history of cooperation and are strengthening their technological leadership to provide integrated AI solutions to their global customers.