Overview

• Silan Microelectronics signed a strategic cooperation agreement on October 18 with Xiamen's municipal and Haicang district governments to build a 12-inch high-end analog IC production line in Haicang.
• The plan calls for an IDM operating model with fully proprietary intellectual property and performance benchmarked against international leaders.
• Total investment is planned at RMB 20 billion in two phases, with Phase I budgeted at RMB 10 billion and Phase II adding another RMB 10 billion.
• Phase I is scheduled to start construction before the end of 2025, target initial line-up and production in the fourth quarter of 2027, and reach full output in 2030 at 240,000 12-inch wafers per year.
• Phase II is planned to expand capacity by an additional 300,000 12-inch wafers annually on top of the Phase I output.