SiCarrier Showcases Advanced Chipmaking Tools at Semicon China

The Huawei-linked Chinese firm claims its technologies enable 5-nanometer chip production without EUV lithography, but challenges in scaling and yields persist.

• SiCarrier debuted a comprehensive catalog of semiconductor manufacturing tools at the Semicon China industry fair, signaling its ambitions to rival global equipment makers.
• The company claims its multi-patterning technology using DUV lithography can produce 5-nanometer chips, bypassing the need for U.S.-restricted EUV tools.
• SiCarrier collaborates closely with Huawei and is backed by a government fund in Shenzhen, underscoring China's push for technological self-sufficiency in semiconductors.
• While its tools are reportedly used by major Chinese foundries like SMIC, the feasibility of achieving competitive yields and scaling advanced production remains uncertain.
• The firm continues to aggressively recruit talent from industry leaders like ASML and Applied Materials to accelerate development and innovation.

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