Overview

• Prime Minister Narendra Modi met industry leaders as IT minister Ashwini Vaishnaw unveiled 13 initiatives, including the first made‑in‑India chips and a systems microphone for earbuds, wearables and digital identity devices.
• Strategic tie‑ups included Tata Electronics–Merck to advance Tata’s Gujarat fab and Tata Electronics–C‑DAC to strengthen design and IP, alongside collaborations among Kaynes Semicon, SPARSH‑IQ Solutions, 3rdiTech, Focally and SenseSemi for indigenous automotive and industrial AI vision solutions.
• L&T Semicon and IISc announced India’s first National Innovation Hub for semiconductors and quantum technology, an IoT Evolution Board powered by the indigenous VEGA processor debuted, and the India Deep‑Tech Investment Alliance launched with a $1 billion commitment.
• ISRO presented the Vikram 3201 space‑grade 32‑bit microprocessor to the Prime Minister, developed by VSSC and fabricated at SCL on 180 nm CMOS with a custom ISA and in‑house Ada toolchain, and flight‑validated on the PSLV‑C60 POEM‑4 mission.
• State momentum featured Odisha signing Rs 2,655 crore in MoUs for semiconductor units with TopTrack Hi‑Tech PCB and SancodeTech partners, with officials outlining SiC wafer fabrication and packaging timelines tied to new facilities in the state.