Samsung’s ‘Heat Pass Block’ Puts a Built-In Heatsink on Exynos 2600, With External Licensing on the Table

Overview

• Reports describe HPB as a copper heatsink placed directly over the application processor with the DRAM moved to the side to improve heat dissipation.
• ET News cites internal figures claiming roughly a 30% thermal improvement versus prior Exynos chips, which has not been independently confirmed.
• Samsung Foundry is positioning HPB, alongside its 2nm effort, to win back mobile application processor orders from customers that have shifted to TSMC.
• Coverage notes recent heat concerns around Qualcomm’s Snapdragon 8 Elite Gen 5 as a potential use case for HPB, though no licensing deals have been announced.
• The Exynos 2600 remains unannounced, and widely circulated expectations about specs such as a 2nm process or a deca-core CPU are described as speculative.