Samsung's HBM3E Chips Approved for NVIDIA AI Processors

Samsung's 8-layer HBM3E chips pass quality tests, paving the way for supply deals with NVIDIA by late 2024.

Samsung's HBM3E chips address previous heat and power consumption issues, meeting NVIDIA's requirements.
The approval allows Samsung to compete with SK Hynix and Micron in the high bandwidth memory market.
Chinese companies are stockpiling older HBM2E chips from Samsung ahead of new U.S. export restrictions.
NVIDIA's AI chips will benefit from the enhanced performance and efficiency of Samsung's HBM3E chips.
Samsung aims for HBM3E to constitute 60% of its HBM sales by the fourth quarter of 2024.