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Samsung Unveils Advanced AI Chip Technologies to Challenge TSMC

New innovations in 2nm and 4nm nodes aim to boost performance and reduce production times

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Samsung's logo displayed at the company's Seocho building in Seoul, South Korea, on April 30, 2024
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The Samsung logo seen at the International Consumer Electronics Fair IFA in Germany. Photo: dpa-Zentralbild/dpa

Overview

  • Samsung introduced its SF2Z and SF4U nodes, targeting high-performance AI chip production.
  • The company plans to integrate backside power delivery technology to enhance chip efficiency.
  • Samsung's turnkey foundry service aims to reduce AI chip production time by 20%.
  • Mass production of the 2nm SF2Z node is slated for 2027, with 4nm SF4U set for 2025.
  • Samsung aims to significantly increase its market share in the AI chip sector dominated by TSMC.