Samsung Unveils Advanced 3D Packaging for Next-Gen HBM4 Memory

New SAINT platform promises significant performance and efficiency gains for high-performance computing and AI applications by 2025.

Samsung's SAINT-D technology vertically stacks HBM memory on CPUs and GPUs, eliminating the need for a silicon interposer.
This 3D packaging method reduces power consumption, enhances data transfer rates, and improves signal quality.
The SAINT platform includes different stacking techniques for various chip types, such as SRAM and logic chips.
Samsung aims to offer these advanced packaging services as a turnkey solution, targeting AI accelerators from companies like Nvidia.
The new HBM4 memory, utilizing SAINT-D, is expected to debut in 2025, with broader applications in high-performance computing.