Samsung Touts Exynos 2600 Heat Pass Block, Plans to Offer Packaging to Rivals
Samsung positions the copper heat-sink package to curb throttling as it courts outside chip clients.
Overview
- ET News reports the Exynos 2600 uses a Heat Pass Block that places a copper heatsink directly over the processor and relocates DRAM to the side.
- The packaging change is claimed to lower operating temperatures by roughly 30% versus previous Exynos chips, aiming to reduce thermal throttling.
- Samsung intends to make the HPB packaging available to external customers, with reporting naming Qualcomm and Apple among potential adopters.
- Coverage suggests the approach could address recent thermal concerns around Snapdragon 8 Elite Gen 5, though any deployment remains unconfirmed.
- Real-world effectiveness and performance impacts have not been independently verified, and reports based on leaks should be treated as provisional.