Samsung to Invest $280M in Advanced Chip Packaging Research Facility in Japan

The investment, supported by the Japanese industry ministry, aims to enhance collaboration with Japanese chipmaking equipment manufacturers and bolster Samsung's global chip market leadership.

Samsung Electronics plans to invest approximately 40 billion yen ($280 million) over five years in a new advanced chip packaging research facility in Japan.
The facility will be located in Kanagawa prefecture, where Samsung already has a research and development center.
This move is part of Samsung's strategy to enhance collaboration with Japanese chipmaking equipment and materials manufacturers.
The Japanese industry ministry supports this initiative by offering subsidies of up to 20 billion yen to aid in rejuvenating Japan's domestic chip manufacturing sector.
The new facility in Yokohama will not only bolster Samsung's leadership in the chip industry but also facilitate partnerships with local packaging-related companies, further integrating and expanding Samsung's reach in the global chip market.