Overview

• Samsung Electronics plans to invest approximately 40 billion yen ($280 million) over five years in a new advanced chip packaging research facility in Japan.
• The facility will be located in Kanagawa prefecture, where Samsung already has a research and development center.
• This move is part of Samsung's strategy to enhance collaboration with Japanese chipmaking equipment and materials manufacturers.
• The Japanese industry ministry supports this initiative by offering subsidies of up to 20 billion yen to aid in rejuvenating Japan's domestic chip manufacturing sector.
• The new facility in Yokohama will not only bolster Samsung's leadership in the chip industry but also facilitate partnerships with local packaging-related companies, further integrating and expanding Samsung's reach in the global chip market.