Overview

• ETNews reports Samsung’s foundry is preparing the Exynos 2600 for full-scale output, suggesting earlier 2nm yield problems have improved.
• The chipset is reported to use Heat Pass Block packaging to manage thermals, targeting a persistent overheating concern for Exynos devices.
• Galaxy S26 variants are expected to be split by region between Exynos 2600 and Qualcomm’s Snapdragon, according to industry reporting.
• TSMC has reportedly communicated 5–10% price increases for advanced 3nm and 2nm nodes in 2026, potentially making Snapdragon-based options pricier for Samsung.
• Leaked Geekbench entries indicate near-parity performance with Snapdragon for Exynos 2600, though the results remain unverified.