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Samsung Prepares Flexible Chipset Strategy and Design Overhauls for Galaxy S25 FE and Foldables

New leaks reveal Samsung's contingency plans for chipset shortages, cost-saving measures in Fan Edition devices, and significant design upgrades for its foldable lineup.

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Samsung Galaxy Z Flip 6 runs on Snapdragon 8 Gen 3 Mobile Platform for Galaxy
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Overview

  • The Galaxy S25 FE may pivot to MediaTek's Dimensity 9400 chipset if Exynos 2400e supply is insufficient, though Samsung aims to maintain its price point.
  • The Galaxy Z Flip 7 is reported to feature Samsung's Exynos 2500 chipset in certain regions, marking a shift from Qualcomm's Snapdragon processors.
  • The Galaxy Z Flip FE has appeared on Geekbench with the Exynos 2400 chipset, but some reports suggest it might still use the Snapdragon 8 Gen 3 in select markets.
  • Leaked design details for the Galaxy Z Flip 7 point to a larger ~4-inch cover display, while the Galaxy Z Fold 7 is rumored to have inner bezels reduced to just 1 mm.
  • Samsung's foldable lineup, including the Z Flip 7, Z Flip FE, and Z Fold 7, is expected to debut at the Galaxy Unpacked event in July 2025.