Overview

• Korea JoongAng Daily reports Samsung has cleared Nvidia’s quality test for its 12‑layer HBM3E and is preparing to supply the chips.
• Shipments are expected to be limited this year because Nvidia’s allocations were largely secured earlier from SK hynix and Micron.
• AlphaBiz, cited by SamMobile, reports an initial order of about 10,000 HBM3E 12‑layer units, a figure not publicly confirmed by Nvidia.
• SK hynix says HBM4 development is complete and preparations for mass production are underway, reinforcing its leadership in high‑bandwidth memory.
• Samsung had faced thermal and performance setbacks with HBM3/HBM3E, has supplied 12‑layer parts to AMD and Broadcom, and now becomes the third Nvidia‑approved HBM supplier.