Overview
- Samsung held an opening ceremony for the Advanced Package Lab in Yokohama on Tuesday, September 8, 2026, and the facility has begun full operations with roughly 100 Japanese and Korean engineers.
- The lab will focus on advanced semiconductor "package" technology that links multiple chip dies to raise AI and high‑speed communications performance while cutting power use.
- Japanese central and local authorities have pledged significant subsidies for the project, with METI reporting up to ¥20 billion in support through 2028 and local reporting describing a broader ¥40 billion, five‑year investment plan that includes ¥2.5 billion from Yokohama City.
- APL is partnering with more than 50 Japanese companies, including Tokyo Electron and Ibiden, to combine Samsung’s production experience with Japan’s materials and equipment expertise.
- Officials say the center is meant to strengthen domestic manufacturing capability and supply‑chain resilience and to help Japan and Samsung narrow gaps with leaders in advanced packaging such as TSMC while creating local R&D jobs and supplier demand.