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Samsung Faces Setbacks with HBM3E Memory in Nvidia Tests

Heat and power consumption issues hinder Samsung's progress in securing Nvidia's AI chip orders, raising concerns over its competitive position.

  • Samsung's HBM3E memory chips failed Nvidia's qualification tests due to excessive heat and power consumption.
  • The failure impacts Samsung's efforts to compete with SK Hynix and Micron Technology in the AI chip market.
  • Samsung denies the failure claims, stating that optimization processes are ongoing with partners.
  • Nvidia, which holds an 80% market share in AI processors, is a crucial customer for HBM manufacturers.
  • Samsung's leadership changes in its semiconductor unit reflect the company's response to these challenges.
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