Overview

• Samsung's LPDDR5X chips are 9% thinner and offer 21% better heat resistance than previous models.
• The 12GB and 16GB memory packages are built using advanced 12nm process technology.
• Innovative 4-stack design and optimized PCB and epoxy molding techniques enable the ultra-thin profile.
• Improved airflow from the thinner chips enhances thermal control in high-performance devices.
• Future plans include developing even denser 6-layer and 8-layer LPDDR5X modules.