Samsung Begins Mass Production of Ultra-Thin LPDDR5X Memory Chips

New 0.65mm DRAM packages promise improved thermal management for on-device AI applications.

Samsung's LPDDR5X chips are 9% thinner and offer 21% better heat resistance than previous models.
The 12GB and 16GB memory packages are built using advanced 12nm process technology.
Innovative 4-stack design and optimized PCB and epoxy molding techniques enable the ultra-thin profile.
Improved airflow from the thinner chips enhances thermal control in high-performance devices.
Future plans include developing even denser 6-layer and 8-layer LPDDR5X modules.